Optical & Electronic Component Measurement

Application Background

With the rise of high-speed communications, 5G, and photonic integration, dimensional accuracy in optical and electronic components has become increasingly critical. Non-ferrous connectors made of stainless steel, copper, or aluminum are often small and soft—prone to scratching or deformation when measured with traditional contact probes. USDV’s tele-centric image TIMI system provides fast, automated measurement without damage. It accurately analyzes contours composed of arcs and lines using tele-centric imaging—up to 50× faster than conventional lab methods—offering a precise, non-destructive, and high-throughput inline inspection solution.

Common Challenges

• Tiny, complex parts are difficult to measure with contact probes
• Chamfers and curved transitions can't be captured with a single tool
• Long inspection times and no real-time data visibility
• High-value parts are costly to scrap due to measurement errors
• Manual tools (microscopes/projectors) lack traceability and are labor-intensive

Solution & Advantages

• Supports ø1mm–ø40mm micro components
• Precision contour analysis: roundness, curvature deviation, auto-fit baseline
• Non-contact to prevent scratches and accumulated errors
• Robotic loading support for inline batch inspection
• Integrated SPC reports, GO/NG judgment, ERP connectivity
• Optional high-magnification optics and micro fixturing for ultra-small parts

Key Benefits

• Measures complex contours and multi-segment profiles with high precision
• 10–30 second cycle time, over 50× faster than traditional methods
• Real-time SPC and visual reports for fast process control
• Scalable for full automation and smart manufacturing systems